No.8
Disclosure
2026/10/01 09:00
対外投資
晶合集成关于拟对外投资暨关联交易的公告
晶合集成关于拟对外投资暨关联交易的公告
688249 NEXCHIP SEMICONDUCTOR CORPORATION晶合集成Shanghai Stock Exchange
8 posts
NEXCHIP SEMICONDUCTOR CORPORATION (688249) at a glance
Prices are from Yahoo! Finance and may be delayed. Always check the latest price before trading.
NEXCHIP SEMICONDUCTOR CORPORATION (688249) share price over the last 3 months
Over the last 3 months (Jun 30 – Sep 30), NEXCHIP SEMICONDUCTOR CORPORATION traded between a high of CN¥65.21 (Jul 9) and a low of CN¥32.81 (Sep 30). It closed at CN¥32.81 on Sep 30, −44.4% from 3 months ago and −15.4% from a month ago.
3-month highCN¥65.21Jul 9
3-month lowCN¥32.81Sep 30
vs 1 month ago−15.4%vs Aug 31
vs 3 months ago−44.4%vs Jun 30
Closing prices, last 10 trading days
| Date | Close | Change | % Change |
|---|---|---|---|
| Sep 30 (Wed) | CN¥32.81 | −1.27 | −3.73% |
| Sep 29 (Tue) | CN¥34.08 | +0.87 | +2.62% |
| Sep 28 (Mon) | CN¥33.21 | −1.61 | −4.62% |
| Sep 24 (Thu) | CN¥34.82 | −1.54 | −4.24% |
| Sep 23 (Wed) | CN¥36.36 | −0.25 | −0.68% |
| Sep 22 (Tue) | CN¥36.61 | +0.06 | +0.16% |
| Sep 21 (Mon) | CN¥36.55 | −0.20 | −0.54% |
| Sep 18 (Fri) | CN¥36.75 | +1.74 | +4.97% |
| Sep 17 (Thu) | CN¥35.01 | −0.66 | −1.85% |
| Sep 16 (Wed) | CN¥35.67 | +1.37 | +3.99% |
Daily closing prices from Yahoo! Finance. Always check the latest price before trading.
Recent announcements (CNINFO, in Chinese)
- 10/01 H株関連の公告 H股公告-(I)关连交易订立增资协议(II)有关涉及增资及股东协议之关连交易之进一步资料
- 10/01 対外投資 晶合集成关于拟对外投资暨关联交易的公告
- 10/01 株主総会の招集 晶合集成关于召开2026年第一次临时股东会的通知
- 10/01 取締役会決議 晶合集成第二届董事会独立董事专门会议第十一次会议决议
- 10/01 株主総会 晶合集成2026年第一次临时股东会会议资料
Posts
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No.7
Disclosure
2026/10/01 09:00
株主総会の招集
晶合集成关于召开2026年第一次临时股东会的通知
晶合集成关于召开2026年第一次临时股东会的通知
Delete
No.6
Disclosure
2026/10/01 09:00
取締役会決議
晶合集成第二届董事会独立董事专门会议第十一次会议决议
晶合集成第二届董事会独立董事专门会议第十一次会议决议
Delete
No.5
Disclosure
2026/10/01 09:00
株主総会
晶合集成2026年第一次临时股东会会议资料
晶合集成2026年第一次临时股东会会议资料
Delete
No.4
Disclosure
2026/10/01 09:00
会計監査人の選任
晶合集成关于续聘会计师事务所的公告
晶合集成关于续聘会计师事务所的公告
Delete
No.3
Disclosure
2026/10/01 09:00
対外投資
中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司拟对外投资暨关联交易的核查意见
中国国际金融股份有限公司关于合肥晶合集成电路股份有限公司拟对外投资暨关联交易的核查意见
Delete
No.2
Disclosure
2026/09/30 09:00
変更届
晶合集成关于变更公司注册资本、修订《公司章程》并办理工商登记的公告
晶合集成关于变更公司注册资本、修订《公司章程》并办理工商登记的公告
Delete
No.1
Disclosure
2026/09/15 09:00
ストックオプション
晶合集成关于2023年限制性股票激励计划预留授予部分第一个归属期归属结果暨股份上市公告
晶合集成关于2023年限制性股票激励计划预留授予部分第一个归属期归属结果暨股份上市公告
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